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The directors of the printed boards development technology modifications are connected with the electronics industry advances, lowering the production costs and with increasing environment protection needs. Technical considerations include large integration-scale components which needed ideally flat soldering pads. Traditional materials used for protection of the copper surface on the boards and technologies connected with this process do not meet those expectations. Furthermore, the most commonly used Sn/Pb alloy coating contains a toxic metal - lead, usage of which will be forbidden after 2004. This paper presents new finishing materials (metallic coating and organic solderability preservatives) and tests useful for evaluating the new protective finishing quality. Results of these tests allow statement of the influence which the boards are subject to during storage and mounting on the properties of the protective finishes. They make possible the choice of an optimal printed board soldering protection technology.
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